型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
---|---|---|---|---|---|---|---|---|
K4E8E324ED-EGCG | IC |
SAMSUNG/三星 |
BGA178 |
20+ |
20 |
|||
MT29F2G16ABBEAH4:E | IC |
MICRON/美光 |
BGA |
15+ |
200 |
|||
IP2112A-ST | IC |
INJOINIC/英集芯 |
SOT23-6 |
2019+ |
2000 |
|||
LTM4613V | IC |
LINEAR/凌特 |
BGA |
18+ |
1 |
|||
BM57SPP05MC2 | IC |
MODULE |
SMD |
13+ |
13 |
|||
PIC16F722-E/SP | IC |
MICROCHIP/微芯 |
DIP28 |
0839+ |
3 |
|||
MCP2515-I/P | IC |
MICROCHIP/微芯 |
DIP18 |
07+ |
4 |
|||
ICE65L01F-LQN84C | IC |
SILICON/芯科 |
QFN84 |
11+ |
10 |
|||
AML8726-MX-D | IC |
AMLOGIC/晶晨 |
BGA |
06+ |
1 |
|||
LFEC3E-3T144C | IC |
LATTICE/莱迪斯 |
QFP |
16+ |
5 |
|||
CD4016BE | IC |
TI/德州仪器 |
DIP14 |
01+ |
260 |
|||
ATMLU824 | IC |
ATMEL/爱特梅尔 |
DIP8 |
1824+ |
280 |
|||
HEF4071BP | IC |
NXP/恩智浦 |
DIP |
08+ |
145 |
|||
TL062CP | IC |
TI/德州仪器 |
DIP |
02+ |
190 |
|||
TSF5N60M | IC |
TRUESEMI/信安 |
TO220 |
10+ |
1150 |
|||
MOC3041 | IC |
FAIRCHILD/仙童 |
DIP |
09+ |
180 |
|||
GL850G | IC |
GENESYS/创惟科技 |
SOP28 |
02+ |
140 |
|||
CD4073BCN | IC |
NS/美国国半 |
DIP14 |
9048+ |
20 |
|||
TNY254P | IC |
POWER INTEGRATIONS/帕沃英蒂格盛 |
DIP8 |
09+ |
260 |
|||
HD74LS157P | IC |
RENESAS/瑞萨 |
DIP |
08+ |
350 |
|||
SN74HC245N | IC |
NXP/恩智浦 |
DIP |
13+ |
20 |
|||
TSC74HC244AN | IC |
MOTOROLA/摩托罗拉 |
DIP |
9415+ |
125 |
|||
DM7406N | IC |
FAIRCHILD/仙童 |
DIP |
0124+ |
37 |
|||
S6120 | SDS/芯飞凌 |
SOT23-6 |
2016+ |
3500 |
||||
CT814-MIT | 其他被动元件 |
AMS/艾迈斯 |
SMDbga |
12+ |
112000 |
|||
STM32F413VGT6 | 32位MCU |
ST/意法 |
LQFP100 |
20+ |
540 |
|||
AT697F-KG-E | 其他被动元件 |
ATMEL/爱特梅尔 |
NA |
1029+ |
1 |
|||
TLV74318PDQNR | TI/德州仪器 |
X2SON-4 |
22+ |
12000 |
||||
MC9S12D64CFUE | 内存芯片 |
FREESCALE/飞思卡尔 |
QFP80 |
1032+ |
67 |
|||
SCB15H2G160AF-13K | UNILC/紫光国芯 |
BGA96 |
20+19+ |
300 |